Aerospace part manufacturer in USA (Mass) was moving facilities. One aspect of their packaging process required the use and spraying of an oil preservative, requiring air handling equipment and hoods at every packing station, as well as expensive heat and vacuum sealing equipment. All would be needed for continued use of foil bags (mil-B-131 foil bags).
Find a new Barrier Packaging Solution that would:
- Increase worker safety
- Increase productivity and packaging efficiency
- Enable packaging re-usability (to allow for additional quality assessments)
- Eliminate the need for packing station equipment and maintenance
Static (Corrosion) Intercept Bags — Safe, Reliable, Reusable, Cost Effective
Electronic packaging is a major discipline within the field of electronic engineering, and includes a wide variety of technologies. It refers to enclosures and protective features built into the product itself, and not to shipping containers. It applies both to end products and to components.
Electronic Packaging is a leading developer and manufacturer of hermetic housings and other components for the reliable, long-term protection of sensitive electronics. Our core technologies are glass-to-metal and ceramic-to-metal sealing, thermal sensing components as well as a variety of cutting edge specialty glass competences.
Forms of Supply and Product PackagingStandard forms of supply are available. Please contact our sales department if you have any special requests concerning supply and packaging.
Your project may not include new equipment, but refurbished and relocated systems. We have successfully implemented projects where production lines have been relocated from one plant to another with the equipment being refurbished in the process. This can be done on a domestic or international basis. Gulmohar packtech has successfully provided line integration services along with the purchase of our equipment for years. We have worked with a significant number of other OEM manufacturers from upstream product supply systems to downstream secondary packaging equipment
EVALUATION OF INTERCEPT BARRIER MATERIAL FOR MILITARY PACKAGING:
Presented by: Fred Schumann, TACOM-ARDEC Logistics R&D Activity For Samir Sarkar, TACOM-ARDEC, Packaging & Engineering, Support Division, Picatinny Arsenal N.J. 07806-5000. TACOM also certified Intercept Technology as a cost-effective replacement for MIL-B-131J foil. Their presentation summary stated “One mil thick INTERCEPT can protect multi-metal components for ten year period against corrosion; less inspection/labor/disposal. Total cost of a packaging with INTERCEPT can be lowered in specific applications without compromising performance. Net saving being realized by eliminating additional wrap, associated labour and material cost.”
A more recent Army presentation to the TACOM Corrosion Summit 2003 showed Static Intercept Foil (aka Intercept Poly) significantly outperformed MIL-B-131J foil. Further, TACOM certified that Intercept Technology was compatible with the explosives tested including TNT, HDX, and RDX.
We provide the following services to our customers and prospects:
Identify customer’s product/s which require protection against CORROSION and/or Electro-Static Discharge (ESD) and study current measures for such protection and their effectiveness.
Analyze customer’s entire packaging process and materials used to pinpoint where and how the protection regime may be improved in terms of :
Recommend the most appropriate item/s from the wide array of INTERCEPT TECHNOLOGY ™ products to achieve the objectives listed above.
Provide samples for evaluation without any obligation. Customers will only need to fill us in on the outcome of their evaluation